Cooler for COM Express Basic Embedded Computer Modules

Intel® Core™ i3, i5, i7 , Intel® Celeron® 800 series , AMD R-Series Generation

The specifications for COM Express™ Embedded Computer Modules include a heatspreader.
It's a mechanical definition of the thermal interface.  
All the heat generated by components such as chipsets and processors are transferred to the system's cooling via the heatspreader.
Various heatsinks and Cooling solutions for different system integration project.  

Odoo CMS - a big picture

Asia Pacific

10F-3, No. 270, Sec 4, Chung Hsiao E. Road, Taipei, 10694, Taiwan
Phone: +886-2-2751-7192
Email: [email protected]


Ulrichsberger Str. 17, Haus G1, 94469 Deggendorf, Germany
Phone: +49-991-2009298-0
Email: [email protected]


570 W. Cheyenne Ave., Suite 210, North Las Vegas, NV 89030
Phone: + 1-702-848-5320
Email: [email protected]

UK & Ireland

Phone: +44 (0) 7976-155552
Email: [email protected]

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    • Aluminum
    • (COM Express Compact) Aluminum base 2mm~5mm with Thermal Stacks
COM Basic
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    • 125(W) x 95(D) x 17(H) mm
    • 125(W) x 95(D) x 20(H) mm
COM Compact
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    • 95(W) x 95(D) x 17 (H) mm
    • 95(W) x 95(D) x 20 (H) mm